ASM Pacific Technology delivers 100 x 300mm eadframe packaging set up
July 26, 2012 -- Semiconductor packaging and assembly equipment supplier ASM Pacific
Technology Limited noted in its H1 2012 results a record level of orders for leadframes in Q2. It also delivered what it calls the largest leadframe packaging set up to date.
â€oe Overall, the market demand continues to be driven by portable electronic products such as smart phones and tablet computers,― said Lee Wai Kwong, CEO, ASM.
Leadframes benefited from improved market demand, lower raw material prices, and operational improvements, ASM reported. The company also moved its leadframe packaging users to floating prices.
ASM delivered a leadframe packaging set up -- equipment and leadframes -- for 100 x 300mm leadframes to a packaging customer in Q2. This is currently the widest leadframe on the market and therefore cost-efficient, ASM said. The equipment had to overcome specific production and packaging challenges with this leadframe matrix size.
Also read: Contemporary semiconductor packaging experts open up on cost, covering Leroy A. Christie, ASM Pacific, presenting on large leadframe matrices at SEMICON West.
ASM Pacific Technology Limited provides semiconductor assembly and packaging equipment, as well as SMT equipment. Learn more at www.asmpacific.com.
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