Sunday, July 8, 2012

World most prominent partner for your IC, Discrete and LED assembly

ASM has produced some of the semiconductor assembly equipment that has made an impact to the world semiconductor industry since 1975.

The Camera module in-line system, about 54% of world CMOS Sensor on your camera is in fact assembled by the ASM solution. Likely your hand phone cameras module was once assembled by ASM equipment. As the larger the number of Pixel on the CMOS sensor, the smaller the foreign particle down to size of 1.5 microns that the CMOS sensor can not tolerate this contamination. As ASM is the only company that has in-line -solution from Die bonding, curing wire bonder, inspection and lens holder attached line with full clean cell solution to prevent FM contamination. Top 3 World EMS company is in fact the users.

Numerous ASIC, SOIC, BGA and QFN was in fact made by ASM auto-line which has only 2 operators to take care one line each produces 8,000 to 10,000 assembled chip with dies at the input and fully functionable IC chips were made at the output… the whole process has undergone Die bonding, curing, wire bonding, inspection, molding, saw singulation, test auto inspection and taping…The turn around time from a new production wafer to finished assembly chip is possible to be made within 30 hours. Only Auto-line can do that.

Industry first auto molding system that can deliver 170Tons Clamping tonnage at the same time handle world largest 100MMx 300MM leadframe size… a few machine are being running in qualification mode in one of the World Largest Subcon houses , with this Hi Density Lead frame solution, the cost of the leadframe, encapsulation compounds could be saved, and that is becoming additive to your profit… the Only way to move into volume production devices like SOIC, TSSOP and in future QFN…

Dual head Flip Chip bonder, dual Dispenser 12 inch Die bonder, and precision die bonder for stack die on 12” wafers. Dual head copper wire bonders for the QFN application, that one US IDM is using the Copper wire bonder for assembling more than 6 million ICs a day.

Not less than 50% of world hi brightness LED is likely using ASM LED equipment for assembly production. Well, the low power LED below 0.2W is different area as there are more choice of equipment from Taiwan, China, and other makers at much lower cost besides ASM. Still ASM is the leader in the LED assembly as they have 25 years experience in designing, manufacturing the LED bonding, testing and assembling equipment.

If you are going Copper from Gold wire, if you are running SOIC, TSSOP with low profit margin, if you are building CIS Camera Module for no matter Apple and Samsung. If you are not using ASM equipment,, it may be good for you to contact ASM for more technical information. This may be a way for helping you to increase your profit margin. Today’s economy situation is dull, and yet this might be the best time for you to Invest…as you may get a better terms of delivery,
HK Snob

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